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Fabrication and characterization of dry and wet etched InGaAs/InGaAsP/InP long wavelength semiconductor lasers

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Abstract

This paper presents fabrication and characterization of ridge waveguide InGaAs/InGaAsP/InP lasers with an operating wavelength of 1.5µm using reactive ion etching (RIE), chemically assisted ion beam etching (CAIBE) and wet etching techniques. Characterization results of the lasers with 2μm-wide waveguides are given of the two etching methods comparatively using Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM), L-I-V (Light-current-voltage) and spectral measurement techniques. Additionally, a comparison of wet and RIE etched lasers with 20μm-wide waveguide is also discussed. Highly smooth (2.1±0.4nm rms surface roughness) and vertical (~90°) structures are obtained using RIE, in which the 2μm-wide fabricated devices exhibit better performance over the CAIBE etched ones.

©2002 Optical Society of America

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Figures (3)

Fig. 1.
Fig. 1. (a) Surface/sidewall structure, (b) AFM measurement, and (c) etch profile of the RIE etched lasers
Fig. 2.
Fig. 2. (a) Surface/sidewall structure, (b) AFM measurement, and (c) etch profile of the CAIBE etched lasers
Fig. 3.
Fig. 3. L-I-V characteristics of 2μm wide and 400μm long (a) RIE and (b) CAIBE etched lasers, and (c) spectral characteristic for both

Tables (2)

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Table 1. Optimized parameters during RIE and CAIBE etching of InGaAs/InGaAsP/InP

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Table 2. Material parameters of wet and RIE etched InGaAs/InGaAsP/InP lasers with 20μm width and 400μm length

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